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Terabit Era Field Trials Leveraging the CIM 8

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3D Siliconization applies integration and 3D stacking techniques to enable a single packaged device that includes all the high speed opto-electronic functions necessary for coherent communications. This device, which includes the DSP, Silicon Photonic Integrated Circuit, RF drivers and TIAs, is manufactured using standard electronics packaging processes. 3D Siliconization also improves signal integrity and performance via the reduction of electrical inter-connects, in addition to the benefits in cost, reliability, power, and size.

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